Cubot KingKong Power vs Samsung Galaxy M55s

Cubot KingKong Power
Cubot
KingKong Power
Samsung Galaxy M55s
Samsung
Galaxy M55s

概览

品牌
Cubot
Samsung
发布日期
2023年4月, 3 年 2 个月前
2024年9月, 1 年 9 个月前
AnTuTu
224.235 Antutu v9 Overall performance better than 56% of devices
698.000 Antutu v10 Overall performance better than 78% of devices
上市价格
₹ 19,999.00 ($ 210.70)

显示屏

尺寸
6.58"
6.7"
分辨率
1080 x 2408 px FHD+
1080 x 2400 px FHD+
类型
LCD IPS
Super AMOLED
像素密度
401 ppi Very high density
393 ppi High Density
宽高比
20:9
20:9
特性
Hole-punch Notch, 2.5D curved glass screen, Capacitive, Multi-touch, In-cell
Hole-punch Notch, Refresh rate 120 Hz, Always-On Display, Scratch resistant, 2.5D curved glass screen, Corning Gorilla Glass 5, Capacitive, Multi-touch, Frameless

性能

芯片
MediaTek MT8788V
Qualcomm Snapdragon 7 Gen1
CPU
4xCortex A73 2.0GHz + 4xCortex A53 2.0GHz
1x2.4GHz Cortex A710 + 3x2.36GHz Cortex A710 + 4x1.80GHz Cortex A510
CPU 类型
Octa-Core
Octa-Core
制程
12 nm
4 nm
频率
2 GHz
2.4 GHz
GPU
Mali-G72 MP3
Adreno 644
RAM
8 GB
8 GB
RAM 类型
LPDDR4X RAM
LPDDR4X RAM
64 位
Yes
Yes

后置摄像头

分辨率
48 Mpx
50 Mpx
光圈
Unknow
ƒ/ 1.8
像素尺寸
0.80 µm
闪光灯
LED
LED
光学防抖
No
Yes
慢动作
No, 30 fps
Yes, 240 fps
特性
Triple camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Scene mode, Self-timer, Night Vision
4K Video, Digital zoom, Triple camera, Digital image stabilization, Optical Stabilization (OIS), Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

前置摄像头

分辨率
16 Mpx
50 Mpx
光圈
Unknow
ƒ/ 2.4

电池

容量
10600 mAh
5000 mAh
类型
Li-Polymer
Li-Ion
快速充电
Yes , 33.0W
Yes , 45.0W
特性
Non-removable
Non-removable

存储

容量
256 GB
128 GB
SD 卡槽
Yes , Slot for SD or second SIM card
Yes , Slot for SD or second SIM card

机身

尺寸
80.2 mm 169.9 mm 20.0 mm Print 3D Model
76.5 mm 163.9 mm 7.8 mm Print 3D Model
重量
382 g
180 g
材质
Rugged Smartphone, Metal
Plastic
颜色
Black
Black Green
防水防尘
IP68, IP69
可用面积
76 %
85 %

软件

操作系统
Android 13 Tiramisu Android 13
Android 14 Upside-down cake Android 14
Google 服务
With Google Mobile Services
With Google Mobile Services
更新
OS updates: 2 years, Security updates: 4 years

连接

SIM
Dual SIM Dual Standby (Nano SIM + Nano SIM)
Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth
Bluetooth 4.2
Bluetooth 5.2
Bluetooth 配置文件
A2DP (Advanced Audio Distribution Profile)
A2DP (Advanced Audio Distribution Profile), AVRCP (Audio/Visual Remote Control Profile), DIP (Device ID Profile), HFP (Hands-Free Profile), HID (Human Interface Profile), HSP (Headset Profile), MAP (Message Access Profile), PAN (Personal Area Networking Profile), OPP (Object Push Profile), PBAP/PAB (Phone Book Access Profile), HOGP, LDAC, SBC
Wi-Fi
802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac, WiFi 6 (802.11ax)
Wi-Fi 功能
Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB
USB Type-C
USB Type-C
USB 功能
Charging, OTG
Charging, OTG
导航
GPS, A-GPS, GLONASS, Beidou, Galileo
GPS, A-GPS, GLONASS, Beidou, QZSS, Galileo, NavIC System

网络

4G LTE
B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B26 (850), B28a (700), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
B1 (2100), B3 (1800), B5 (850), B8 (900), B28b (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500)
3G
B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800)
B1 (2100), B5 (850), B8 (900)
2G
B2 (1900), B3 (1800), B5 (850), B8 (900)
B3 (1800), B5 (850), B8 (900)
5G
n1 (2100), n3 (1800), n5 (850), n8 (900), n28b (700), n40 (2300), n41 (2500), n77 (3700), n78 (3500)

传感器与安全

指纹
Yes, on the side
Yes, in screen
加速度计
Yes
Yes
陀螺仪
Yes
Yes
距离传感器
Yes
Yes
光线传感器
Yes
Yes
指南针
Yes
Yes
散热系统
No
No
音频
Dolby Atmos, Stereo Speakers

与 Cubot KingKong Power 对比

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    KingKong Power
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  • Cubot
    KingKong Power
    8 GB · 6.58" · MediaTek MT8788V
    Cubot KingKong Power
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    8 GB · 6.58" · MediaTek MT8788V
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  • Cubot
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    8 GB · 6.58" · MediaTek MT8788V
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    8 GB · 6.58" · MediaTek MT8788V
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    blu Bold N2
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    8 GB · 6.58" · MediaTek MT8788V
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与 Samsung Galaxy M55s 对比

  • Samsung
    Galaxy M55s
    8 GB · 6.7" · Qualcomm Snapdragon 7 Gen1
    Samsung Galaxy M55s
    Samsung Galaxy Z Fold6 SE
    Samsung
    Galaxy Z Fold6 SE
    16 GB · 6.5" · Qualcomm Snapdragon 8 Gen3 Leading Edition
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  • Samsung
    Galaxy M55s
    8 GB · 6.7" · Qualcomm Snapdragon 7 Gen1
    Samsung Galaxy M55s
    Samsung Galaxy A25 5G
    Samsung
    Galaxy A25 5G
    6 GB · 6.5" · Samsung Exynos 1280
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  • Samsung
    Galaxy M55s
    8 GB · 6.7" · Qualcomm Snapdragon 7 Gen1
    Samsung Galaxy M55s
    Oppo A80 5G
    Oppo
    A80 5G
    8 GB · 6.67" · MediaTek Dimensity 6300
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  • Samsung
    Galaxy M55s
    8 GB · 6.7" · Qualcomm Snapdragon 7 Gen1
    Samsung Galaxy M55s
    Tecno Camon 30 Pro 5G
    Tecno
    Camon 30 Pro 5G
    12 GB · 6.78" · MediaTek Dimensity 8200 Ultra (MT6896ZB)
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  • Samsung
    Galaxy M55s
    8 GB · 6.7" · Qualcomm Snapdragon 7 Gen1
    Samsung Galaxy M55s
    Vivo T2 5G
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    6 GB · 6.38" · Qualcomm Snapdragon 695 (SM6375)
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  • Samsung
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    8 GB · 6.7" · Qualcomm Snapdragon 7 Gen1
    Samsung Galaxy M55s
    realme GT5 Pro
    realme
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  • Samsung
    Galaxy M55s
    8 GB · 6.7" · Qualcomm Snapdragon 7 Gen1
    Samsung Galaxy M55s
    Asus Zenfone 9
    Asus
    Zenfone 9
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  • Samsung
    Galaxy M55s
    8 GB · 6.7" · Qualcomm Snapdragon 7 Gen1
    Samsung Galaxy M55s
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